Contamination Control
Delivering an Automated Advantage for Our Customers
In semiconductor manufacturing, contamination control remains one of the most direct and cost-effective levers for improving yield without changing established wafer processes. Brooks’ Holistic Contamination Control solutions help customers measure, eliminate, and prevent contamination across wafer carriers and semiconductor tool environments, reducing defectivity and protecting fab performance at scale. Through closed-loop contamination control, Brooks delivers an automated advantage that improves yield, lowers cost of ownership, and strengthens high-volume manufacturing performance.
Solving High-Value Contamination Challenges in Semiconductor Manufacturing
Contamination in semiconductor manufacturing often remains invisible until it impacts yield, process stability, or equipment performance. Particles, films, and chemical contamination can introduce variability and process drift long before issues are detected within wafer processes. As wafers get processed, trace contaminants remain in the carrier and, if not cleaned to a pure level, can impact carrier and wafer production yield.
Without structured contamination control, these issues accumulate over time—driving yield loss, increasing defectivity, and creating operational risk. Identifying sources, controlling environmental conditions, and validating cleanliness are critical to maintaining predictable, high-volume manufacturing performance.
Brooks’ Holistic Contamination Control
Through a structured approach that combines inspection, cleaning, environmental control, and validation, Brooks delivers cleaning methodologies aligned to contamination type, carrier condition, and production requirements to ensure contamination is identified, removed, and prevented across semiconductor manufacturing operations.
Inspect and Verify Carrier Health
Evaluate wafer carriers for particle contamination, mechanical integrity, and filter condition to ensure they meet operational standards before use.
Precision Cleaning and Contamination Removal
Remove particles, chemical contamination (AMC, VOC), and process residues that accumulate during wafer handling and transfer.
Controlled Environment Conditioning
Manage humidity, airborne molecular contamination, and environmental conditions to prevent recontamination.
Return to Production with Confidence
Confirm carriers meet consistent, cleanliness and performance thresholds before reintroduction into high-volume manufacturing.
Proven in Semiconductor Manufacturing Environments
>1,000 Systems Deployed
Holistic contamination control systems deployed across semiconductor manufacturing environments worldwide.
Industry Standard Within Fabs Across Multiple Device Types
Foundry, memory, logic, power device & advanced packaging
>1% Yield Improvement Potential
Up to 45% defectivity reduction. Demonstrated impact of contamination control on production yield performance.
How Contamination Control Is Delivered
Brooks delivers these results through structured contamination control processes that combine inspection, cleaning, environmental control, and validation. These processes are aligned to contamination type, carrier condition, and production requirements to ensure contamination is identified, removed, and prevented across semiconductor manufacturing operations.
Application-Specific Cleaning Recipes
Cleaning processes tailored to contamination type, substrate materials, and process requirements.
Fab Qualification and Ramp Support
Regional contamination specialists support process qualification, production ramp, and repeatable deployment.
Advanced Contamination Studies
Applying deep knowledge and leveraging regional engineering application labs to partner with customers to categorize the source of contamination to optimize cleaning recipes.
Closed-Loop Process Repeatability
Validated measurement, cleaning, drying, and re-measurement create repeatable production outcomes.
Contamination Control Solutions
Brooks delivers contamination control systems that support inspection, cleaning, and data visibility—enabling consistent execution of Holistic Contamination Control across wafer carrier handling and lithography processes.
Carrier Cleaning Systems
Engineered removal of particulate, AMC, and moisture contamination from FOUPs and reticle pods to reduce defectivity, protect carrier integrity, and support production-ready return.
Brooks solutions:
PuroMaxx® LEAP™, PuroMaxx® 800
Measurement, Inspection and Metrology
Inspection systems verify carrier condition, detect contamination, and confirm compliance with operational thresholds.
Brooks solutions:
PuroVision™, PuroMetric™, PuroSense™
Closed-Loop Cleaning, Inspection, and AI Optimization
Connect cleaning, contamination visibility, and AI-driven optimization across production environments to eliminate recurring contamination sources and improve fab-level performance.
Brooks solutions:
PuroSense™ working alongside PuroMaxx® LEAP™, PuroView™ AI-powered FOUP fleet management
Lowering Total Cost of Ownership Across the Equipment Lifecycle
Reduce Yield Loss
Eliminate recurring contamination sources that drive defectivity, scrap, and yield loss.
Extend Carrier and Reticle Life
Reduce contamination-driven wear, replacement frequency, and long-term asset cost.
Minimize Fab Disruption
Validated contamination thresholds and system visibility reduce downtime risk and protect throughput.
Pathway Service
Highly knowledgeable, local support teams available for installation, upgrades and spares.
Improve Contamination Control Performance
Connect with Brooks to address contamination risk, reduce defectivity, and support stable semiconductor manufacturing operations.