Advanced Packaging Automation
Delivering an Automated Advantage for Our Customers
Advanced packaging environments are defined by constant change—substrate formats, weights, thickness, and warpage vary across customers and processes. With no standard process, manufacturers must continuously adapt to new designs and evolving requirements.
Brooks delivers automation systems that adapt in real time to these changing conditions—enabling customers to deploy new processes faster, protect high-value substrates, and maintain stable production performance.
Understanding High-Value Challenges in Advanced Packaging
Advanced packaging requires new approaches and processes to advance capability that addresses complex substrate formats. This variability makes substrate handling inherently difficult. Systems must accommodate changes in size, weight, thickness, and warpage without introducing damage, disrupting flow, or requiring constant reconfiguration. When automation cannot adapt to these conditions, manufacturers face increased breakage, reduced throughput, and slower deployment of new processes.
Improving Advanced Packaging Cost-of-Ownership Through Smart Automation
As Advanced Packaging moves through 300mm and glass substrates, the variability of the substrate is becoming a bigger problem. Brooks solves that problem through advanced imaging, analysis, and real-time adaption of the automation system to prevent this variability impacting you.
The Brooks automated solution drastically reduces the cost-of-ownership by making substrate handling predictable, as our customers push the envelope in advanced packaging.
This capability allows customers to operate across a wide range of process conditions without manual adjustment or system reconfiguration—reducing breakage risk, maintaining alignment, and supporting consistent production performance.
Improving Advanced Packaging Cost-of-Ownership Through Smart Automation
As Advanced Packaging moves through 300mm and glass substrates, the variability of the substrate is becoming a bigger problem. Brooks solves that problem through advanced imaging, analysis, and real-time adaption of the automation system to prevent this variability impacting you.
The Brooks automated solution drastically reduces the cost-of-ownership by making substrate handling predictable, as our customers push the envelope in advanced packaging.
This capability allows customers to operate across a wide range of process conditions without manual adjustment or system reconfiguration—reducing breakage risk, maintaining alignment, and supporting consistent production performance.
Solving Complex Challenges to Optimize Workflows in Advanced Packaging
As advanced packaging technology evolves to meet the needs of the AI enabled future, providing packaging solutions that enhance performance and lower cost is needed. Future advanced packaging processes will integrate workflows to optimize cost-of-ownership and yield. Brooks’ application experience, advanced packaging capability, and proved automation solutions are being deployed to provide our customers with an automated advantage and next-generation workflows.
Proven in Advanced Packaging Production
Demonstrated Partner for Wafer-Level Packaging
Key automation partner to over 25 equipment manufacturers across 12 different vacuum and atmospheric advanced packaging applications.
Leader in Panel-Level Automation
Over 50 systems deployed supporting panel substrates, including 310 × 310 mm for advanced packaging production environments.
Innovating New Workflows for Wafer and Die Sort
Over 10 years’ experience working directly with advanced packaging lines delivering complex wafer and tray die sorting in leading edge advanced packaging facilities.
Proven Advanced Packaging Automation Solutions
Brooks has focused on advanced packaging automation for over 12 years by partnering with leading fabs. We have thousands of automation solutions enabling wafer and panel-level advanced packaging production facilities. provides automation systems designed to operate across advanced packaging workflows—supporting real-time adaptability, precise handling, and consistent performance in high-variability production environments.
Marathon™ Transport Systems
Atmospheric and vacuum automation systems designed to manage complex substrates across wafer, panel, and film-based formats—ensuring consistent movement and positioning across process steps.
Brooks solutions:
Marathon™ Sorter
Marathon™ Sorter Systems
High-speed, reliable, substrate and die tray sorting that can handle a high level of variability.
Brooks solutions:
Marathon™ Sorter
Dynamic Mapping and Adaptive Handling
Vision-based systems measure substrate condition and adjust handling in the time to maintain alignment and reduce damage risk.
Brooks solutions:
Vision LEAP™
Substrate Handling and Transport Systems
Automation systems designed to manage complex substrate formats across wafer, panel, and tape frame – ensuring consistent movement and positioning across process steps.
Brooks solutions:
EFEM platforms, transport systems
Lowering Cost of Ownership in Advanced Packaging
Reduce Yield Loss from Substrate Damage
Real-time adaptive handling minimizes breakage, misalignment, and handling-related defects.
Maintain Throughput in Complex Processes
Automation systems maintain consistent flow across changing substrate conditions without manual intervention.
Maintain Production Stability
Systems adapt to changing process conditions in real time, reducing interruptions and unplanned downtime.
Protect High-Value Substrates at Scale
Precision handling and control reduce risk when working with fragile, high-cost substrates.
Keep Production Moving as Conditions Change
Connect with Brooks to enable real-time adaptability across your advanced packaging environment.